Elastic behavior in contact dynamics of rigid particles
نویسندگان
چکیده
منابع مشابه
Elastic behavior in contact dynamics of rigid particles.
The systematic errors due to the practical implementation of the contact dynamics method for simulation of dense granular media are examined. It is shown that, using the usual iterative solver to simulate a chain of rigid particles, effective elasticity and sound propagation with a finite velocity occur. The characteristics of these phenomena are investigated analytically and numerically in ord...
متن کاملElastic behavior of weakly cemented contact
HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L’archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau...
متن کاملInverse dynamics with rigid contact and friction
Inverse dynamics is used extensively in robotics and biomechanics applications. In manipulator and legged robots, it can form the basis of an effective nonlinear control strategy by providing a robot with both accurate positional tracking and active compliance. In biomechanics applications, inverse dynamics control can approximately determine the net torques applied at anatomical joints that co...
متن کاملConstitutive equations for an elastic material with anisotropic rigid particles.
In this paper we have derived constitutive equations for an elastic material with anisotropic rigid particles. We have included a dependence on the Finger tensor B and the orientation tensor Q in the expression for the free energy of the system. With this expression for the free energy we have derived an expression for the stress tensor up to second order in both these variables. We have shown ...
متن کاملThe Effects of Interfacial Particles on the Contact of an Elastic Sphere With a Rigid Flat Surface
In chemical mechanical polishing (CMP), a rigid wafer is forced on a rough elastomeric polishing pad, while a slurry containing abrasive particles flows through the interface. One of the important factors that influence the material removal rate in CMP is the magnitude of contact force transmitted to the abrasive particles trapped at the contact interface. The total push-down force is distribut...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Physical Review E
سال: 2002
ISSN: 1063-651X,1095-3787
DOI: 10.1103/physreve.65.061305